SONY joins NXP Semiconductors for contactless Mobile Phone Transactions
22 November 2006 by axxxr NXP Semiconductors, formerly Philips Semiconductors, and Sony have signed a memorandum of understanding (MOU) to establish by mid-year 2007 a joint venture (JV) that will drive global adoption of contactless smart card applications in mobile phones.
The anticipated JV will plan, develop, produce and market a secure chip that will include both MIFARE and FeliCa operating systems and applications, as well as other contactless card operating systems and applications. By combining this secure chip with an NFC chip a universal contactless IC platform can be created for mobile phones. As a result, mobile device manufacturers and service providers around the world will be able to design products and services which are compatible with the different contactless IC protocols and operating systems that are already deployed in different countries. Therefore consumers will be able to enjoy multiple applications such as payment and transport ticketing from various service providers on one device. www.nxp.com
Comments On 22 Nov 17:22 Prom1 wrote Great so if I get jacked on my SE phone somebody, admist the holiday rush and make payments to my dismay. Great advancement of technology. |
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