| Author |
Sony Xperia Rumors 2015 |
nodarsixar
Joined: May 22, 2013
Posts: > 500
From: AD
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I think
Xperia Z5+/Z6/Z5 Ultra in May 2016 and Z7/Z7 Premium and Z7 Compact=IFA
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MyP910
Joined: Feb 16, 2005
Posts: 499
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Yeay.... Vaio phone. I've been waiting for Sony windows phone for so long.... finally. Hope this is true.
Ericsson t10, T310, P800, S600, P910, P990, SEX1, SEX10, SEXArc, XZ, XZ1 |
Ebato
Joined: Mar 11, 2013
Posts: 134
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On 2015-10-26 16:09:26, MyP910 wrote:
Yeay.... Vaio phone. I've been waiting for Sony windows phone for so long.... finally. Hope this is true.
So which one is it, as you can't have both. It's either a Sony phone, or a VAIO. I doubt you'll see a Sony WP, ever, and as of VAIO.... who cares, it's not Sony anyway. |
Gitaroo
Joined: Aug 17, 2013
Posts: > 500
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new rumor
http://www.engadget.com/2015/[....]ng-its-camera-sensor-business/
This should help Sony expanding its sensor business even more. |
MyP910
Joined: Feb 16, 2005
Posts: 499
PM |
On 2015-10-26 19:09:24, Ebato wrote:
On 2015-10-26 16:09:26, MyP910 wrote:
Yeay.... Vaio phone. I've been waiting for Sony windows phone for so long.... finally. Hope this is true.
So which one is it, as you can't have both. It's either a Sony phone, or a VAIO. I doubt you'll see a Sony WP, ever, and as of VAIO.... who cares, it's not Sony anyway.
I still look at VAIO as Sony. Even looking at the current VAIO pc offerings, those are Sony's.
Ericsson t10, T310, P800, S600, P910, P990, SEX1, SEX10, SEXArc, XZ, XZ1 |
nodarsixar
Joined: May 22, 2013
Posts: > 500
From: AD
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Sony VS Samsung gpu test
https://www.facebook.com/1500[....]71236099764870/?type=3&theater
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nodarsixar
Joined: May 22, 2013
Posts: > 500
From: AD
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GPU Test Top10
http://umbrella333.blogspot.com/2015/10/top-10.html
NO |
nightwing369
Joined: Mar 18, 2013
Posts: 415
PM |
Anonymous industry insiders are already talking of rumours about the Snapdragon 820 overheating or just getting quite warm. They admit that is it doesn't fully overheat, like the 810; but that there are obvious ways around the problem, like extra copper heat pipes to evenly distribute and then vent away excess heat. They also admit that all of this is due to performance and efficiency gains as well as a smaller SoC.
http://www.androidauthority.c[....]he-overheating-madness-651894/
Check this for the latest on the upcoming Sony phones for 2013: https://docs.google.com/spreadsheet/ccc?key=0AreyfktYnDHtdHN0bVFPdUFJd0ZiNzZQcjMwV1I5M0E#gid=0 |
supercoolman
Joined: Jun 04, 2013
Posts: > 500
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http://www.amazon.com/gp/product/B015JWFNX2
http://www.amazon.com/gp/product/B015JWFOG8
so Z5 is coming to US after all? |
Wishmaster89
Joined: Jun 02, 2006
Posts: 333
From: Warsaw, Poland
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It's pure physics. Let me explain why.
When the SoC's were made on 45nm and later on 28nm they had bigger footprint which means they could dissipate the heat with less concentration or in other words, they could spread it on larger area which helped keep the heat at reasonable levels.
No comes 14nm where the footprint is smaller cause the chip itself is denser than what was achievable on 28nm and the CPU's and GPU's are getting faster. Technological advancements come at some costs, in this case, OEM's have to figure out the way to dissipate the heat that is produced on a very concentrated spot and that is why they have to use heatpipes to spread the heat more even across the device where it won't be a problem.
Even 7420 throttled due to heat but thanks to lower energy consumption than 810 (thanks 14nm!) it wasn't an oven  |
Ricky D
Joined: Feb 05, 2007
Posts: > 500
From: UK (living in Beijing)
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I'm not sure the footprint of the chip is the biggest issue in overheating from the aspect of spreading the heat.
We have to think about how the heat is generated. The 28nm compared to 14nm is describing the width of the path through the transistors that the electrons have to pass. The pathways are half the width in the newer chips. This will equate to about twice the electrical resistance. That resistance translates into heat as current is passed through.
So why aren't the chips twice as hot?
If the chips were the same size and architecture but simply reduced the pathways to half the width, they would be, but because the designers are learning from old mistakes and reducing the space between the transistors (possible because they are smaller), the electrons have a shorter distance to travel per any given task. The chip doesn't work as long as it would have per task and this hides some of the effect of higher resistances.
At least that's how I understand it.
I have a dig bick
You read that wrong |
Gitaroo
Joined: Aug 17, 2013
Posts: > 500
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shrinking die size ALWAYS decrease the heat generation actually. Look at all intel line up, new one are even fanless. |
Jamzy
Joined: Jun 24, 2015
Posts: 143
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That really doesn't mean much.
Case manufacturers are just targetting those who imported their phones |
Wishmaster89
Joined: Jun 02, 2006
Posts: 333
From: Warsaw, Poland
PM |
On 2015-10-28 16:11:52, Gitaroo wrote:
shrinking die size ALWAYS decrease the heat generation actually. Look at all intel line up, new one are even fanless.
It's not about heat generation but about it's dissipation, besides in case of intel their new CPU's can be fanless cause they were designed this way - lower voltage, reduced performance, turbo mode.
Few years ago I remember reading an article about intel having to revise their cooling solutions to accomodate for the smaller chips and more efficient ways of removing the heat from CPU.
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supercoolman
Joined: Jun 04, 2013
Posts: > 500
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I would recommend people to take at least some modern semiconductor courses before starting to speculate like madness
there are multiple sources of heat generation, but switching (hence frequency) and leakage are the two significant to name these days. leakage gets worse as you shrink the node due to physics. modern transistors aren't as simple as you think, so you need some basics on different modern transistor structure such as finfet, carbon nanotube...etc before you start commenting on this topic |
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Posted: 2015-10-26 15:35
